wafers

英 [ˈweɪfəz] 美 [ˈweɪfərz]

n.  威化饼,薄脆饼(常与冰激凌同吃); 圣饼; 圣体; 面饼; 薄片
wafer的复数



柯林斯词典

  1. 威化饼,薄脆饼(常与冰激凌同吃)
    A wafer is a thin crisp biscuit which is usually eaten with ice cream.
    1. (基督教圣餐仪式上牧师发放的)圣饼
      A wafer is a circular, thin piece of special bread which the priest gives people to eat in the Christian service of Holy Communion.

      双语例句

      1. Remove the wafers with a spoon and transfer them to a plate
        用勺子抄起薄饼,把它们转盛到盘子里。
      2. Some historians believe that it may have been responsible for reports of'blood'on communion wafers and other bread.
        一些历史学家相信这可能是“血”在圣餐礼的圣饼和其它供品上出现的原因。
      3. Research on the Laser Slotting on the Single Silicon Slice and Application; Bonded Wafers-Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
        激光在太阳能单晶硅圆片上划槽控制的研究与应用绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起,作为绝缘层。
      4. Copper nanocrystallites were deposited on mechanically polished single crystal silicon ( sc-Si) wafers by electroless deposition method.
        采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
      5. Required-The minimum specifications needed by the customer when ordering wafers.
        必需-订购晶圆片时客户必须达到的最小规格。
      6. The processing characteristics and some material properties of silicon wafers depend on the orientation.
        硅片的工艺性质与某些材料特性均与晶向有关。
      7. Influence of firing process on bow of thin monocrystalline silicon wafers for solar cells
        烧结工艺对薄片单晶硅太阳电池弯曲的影响
      8. Market estimates for reclaim wafers include semiconductor applications including equipment and IC manufacturing markets.
        硅片回收的市场评估包含了半导体设备及IC半导体市场的应用评估。
      9. Chemical-Mechanical Polish ( CMP)-A process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing.
        化学-机械抛光(CMP)-平整和抛光晶圆片的工艺,采用化学移除和机械抛光两种方式。
      10. Femtosecond laser ablation of silicon wafers in air and water
        飞秒激光在空气和水中对硅片烧蚀加工的实验研究
      11. Prediffusion cleaning chemicals and photo-resist from wafers are more soluble in Hot DI water and therefore more easily removed.
        Prediffusion化学清洁剂和光阻晶圆制造更溶于热去离子水,因此更容易去除。
      12. Particle Counting-Wafers that are used to test tools for particle contamination.
        颗粒计算-用来测试晶圆片颗粒污染的测试工具。
      13. Most electronics are made in the form of integrated circuits, which are tiny chips that contain transistors and other components etched onto silicon wafers.
        大部分电子元件都是以集成电路的形式工作。从外观来看,薄片状的集成电路包含着蚀刻在硅片上的晶体管和其他元件。
      14. Cheese wafers and potato chips are really very good snacks for coffee break.
        喝早茶时吃些奶酪薄片和炸薯条最好不过了。
      15. A reasonably sized semiconductor foundry, by comparison, might produce only 200,000 wafers in a year.
        而相比之下,一家规模适度的半导体工厂可能一年才能生产20万个晶片。
      16. A circuit consisting of two or more semiconductor wafers, each containing a single element.
        一种由两个或多个半导体晶〔圆〕片组成的电路,每个晶片包含一个单独的元件。
      17. Large diameter wafers are feasible and 200-mm wafers have been produced.
        大直径片子已不难制造,200mm的片子也已产生了。
      18. Dopants for silicon wafers are found in Groups III and V of the Periodic Table of the Elements.
        晶圆片搀杂剂可以在元素周期表的III和v族元素中发现。
      19. Ingot-A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.
        晶锭-由多晶或单晶形成的圆柱体,晶圆片由此切割而成。
      20. A typical plant will churn out 3,000 silicon wafers every hour, with each wafer forming one solar cell.
        一家工厂通常每小时能生产3000个硅晶片,每个晶片就构成一枚太阳能电池。
      21. The dust produced during slicing weighs almost as much as the wafers.
        在切割时所产生的碎屑几乎和薄片一样重。
      22. Microstrip circuits withs parameters on different resistance Si wafers are investigated and created a physics model of five-layer microstrip circuits.
        对不同电阻率硅片射频微带电路S参数进行了模拟研究。
      23. Progress on Cleaning Technology of Ge Polished Wafers for Solar Cell
        太阳电池用Ge抛光片清洗技术的研究进展
      24. Bonded Wafers-Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer.
        绑定晶圆片-两个晶圆片通过二氧化硅层结合到一起,作为绝缘层。
      25. Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces.
        切割出的晶圆经过抛光,表面变得毫无瑕疵、如同镜子。
      26. Lithography-The process used to transfer patterns onto wafers.
        光刻-从掩膜到圆片转移的过程。
      27. I guess wafers are out of the question, too, huh?
        我想连华夫饼干也不会有了,是吧?
      28. Bonding interface-the area where the bonding of two wafers occurs.
        绑定面-两个晶圆触接的合结片区。
      29. Research of Polished Technology of VB GaAs Wafers
        VB-GaAs单晶片抛光技术研究