warpage

n.  翘曲,弯曲

机械



双语例句

  1. Research on Process Characteristic of High-gloss Surface Part Injection Technology: Warpage, Shrinkage and Sink Index
    高光注射成型工艺特性研究:翘曲、收缩与沉降指数
  2. A predictive model for warpage is created using feed forward artificial neural network exploiting finite element analysis results.
    建立了使用有限元分析结果的具有提前输入(功能)的人造神经网络的扭曲预制模型。
  3. Testing methods for warpage of refractory bricks
    耐火砖翘曲测定方法
  4. Warpage is one of the most crucial problems during the injection molding process, for its great effect on product quality.
    塑料射出成型制程中,产品翘曲变形量的大小是影响产品质量的主要因素之一。
  5. It has improved surface aesthetics, excellent dimensional stability and low warpage characteristics.
    它改善了耐冲击性和良好的加工特性。
  6. Research of Residual Stresses and Warpage of Plastic Injection Molding Based on Surface Model
    基于表面模型的塑料注射成型残余应力与翘曲变形研究
  7. Research on the thermal stress and warpage of WLCSP device
    晶圆尺寸级封装器件的热应力及翘曲变形
  8. Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate
    基于埋置式基板的三维多芯片组件的翘曲研究
  9. Grid Algorithm Based on Approximate Function for Injection Warpage Optimization
    基于近似函数的注塑翘曲优化网格算法
  10. Curing Shrinkage and Warpage Deformation of Composite Thin Laminates at Room Temperature
    复合材料薄层板常温固化收缩及翘曲变形肯纳薄锡层镀锡薄钢板
  11. In this study, optimum values of process parameters in injection molding of a bus ceiling lamp base to achieve minimum warpage are determined.
    在该论文中,确定了在公共汽车吊灯座的喷射造型法中,获得最小扭曲过程参数的优化值。
  12. Uneven hardening, with the formation of soft spots, increases warpage.
    淬火不均部件上将出现软点,增加翘曲可能性。
  13. Experimental Study on Warpage of Flat Part with Reinforced Rib by Gas-assisted Injection Molding
    气体辅助注塑成型带加强筋平板的翘曲试验研究
  14. Quality optimization and analysis of warpage of injection molding parts based on small the best characteristic
    基于望小特性的注塑产品翘曲质量优选及分析
  15. Simulation on curing warpage deformation of composite T-shaped integrated structure
    复合材料T型整体化结构固化翘曲变形模拟
  16. Surface smoothness and low warpage.
    表面平滑,低翘曲性。
  17. An optimized ram speed profile fully uses the friction heat to keep the best flow characteristics, which corrects many of the fill and warpage problems.
    最适化螺杆速度充分运用摩擦热,将塑流保持在最佳状态。许多充填和翘曲的问题也就迎刃而解。
  18. Most Effective Factors Affecting Warpage of Injection Molded Parts
    注塑制品翘曲变形的最显著影响因素
  19. The shaped errors have many forms, including warpage deformation, Stair-stepping effect and so on in fused deposition modeling ( FDM).
    在熔融堆积成形制造中,形状误差有翘曲变形、台阶效应等形式。
  20. It produces moldings with good surface finish, is resistant to chemicals and stress cracking, and has low shrinkage and warpage.
    它生产的模具表面光洁度好,可耐化学品和应力开裂,并具有低收缩和翘曲。
  21. The principle of precompensation for deformation was presented, which was applied to the shaping of an automobile fan and effectively helped lower the shrinkage deformation and warpage of the product.
    介绍了变形预补偿的原理,以汽车风扇为例,成功地降低了汽车风扇的收缩变形和翘曲变形,为解决制品变形问题提供了一条新的思路。
  22. Effect of Packing Parameters on Warpage of Moulded Part during Injection Moulding Why are vents used on injection moulds?
    注塑成型保压参数对塑件翘曲变形的影响为什么在注塑成型模具中使用排气槽?
  23. It was found that the residual stress and warpage could be predicted well by the proposed simulation.
    通过实例对比分析证明,提出的数值模拟方法能较好地预测制品应力与变形。
  24. Effects of process parameters on the warpage of gas assisted injection molded part
    工艺参数对气辅注射制品翘曲的影响
  25. Warpage of Parts: Uneven surface temperature of the molds.
    变形:不均匀的模具表面温度。
  26. The theory of the Newton ring method is analyzed and the chip warpage is measured by use of the Newton ring method.
    分析了牛顿环法的测量原理,利用牛顿环法对芯片翘曲度进行了测量。
  27. The step to analyze warpage deformation by CAE is given with air condition damper vane as example.
    用有限元方法研究了温度场、压力场对注塑件残余应力及翘曲变形的影响。
  28. According to the statistical results, the injection time is the most important affecting factor on warpage.
    结果表明,注射时间对注塑件翘曲变形的影响最大。
  29. Finite element simulation analysis on warpage after solidifying process of PBGA
    PBGA固化后产生翘曲的有限元模拟分析
  30. Semiconductor analysis with ANSYS tools often incorporates nonlinear behaviors, including package warpage, solder joint creep, fracture in through-silicon-via designs, fatigue and delimitation.
    利用ANSYS工具,可以分析半导体的非线性特性,其中包括封装变形、焊接点蠕变以及过孔设计中的断裂、疲劳和层间开裂。